THE INFLUENCE OF STRUCTURAL DEFECTS ON THE ELECTRONIC AND ADHESIVE PROCESSES AT THE INTERFACE OF THE Bi0.85Sb0.15 SOLID SOLUTION WITH CONTACT ALLOYS
1,2M.M. Tagiyev, 2G.D. Abdinova, 3I.A. Abdullaeva, 2Kh.F. Alieva, 2T.I. Pirieva
2024   C   en   p.60-63

ABSTRACT

The dependence of the resistance of the transition contact rk and the adhesion work of extruded samples of the Bi0.85Sb0.15 solid solution on the magnetic field strength and temperature was investigated. It was found that the resistance of the transition contacts of the Bi0.85Sb0.15 - contact alloy structures is determined mainly by the resistance of the n- Bi0.85Sb0.15 solid solution - Bi0.85Sb0.15 solid solution structure heavily doped with acceptor impurity atoms
Sn and Pb diffusing from the contact alloy into the near-contact region of the crystal.

Keywords: extrusion, annealing, solid solution, extrusion, texture
DOI:10.70784/azip.3.2024CE60

Received: 2024
Internet publishing: 2024

AUTHORS & AFFILIATIONS

1. Azerbaijan State Economic University,Baku city, Istiglaliyat str.,6. AZ-1001, Baku, Azerbaijan.
2. Institute of Physics Ministry of Science and Education. AZ-1073, H. Javid ave.,131, Baku, Azerbaijan.
3. Institute of Radiation Problems of the Ministry of Science and Education. AZ 1143, B. Vahabzade Ave., 9, Baku, Azerbaijan.
E-mail: mail_tagiyev@mail.ru

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